
Wafer Vision Inspection Handler
This is a high speed and high accuracy vision inspection system which provides mapping view and information. Its front pusher is installed with laser sensor to detect the absence and presence of the frame. Its shutter is equipped with pneumatic clamper and moves in X & Y axis for vision inspection. Vacuum sensor is installed in gripper system to detect frame slippage. It contains inking system to do marking on defect unit for ease of traceability. The frame will then be transfer back to the magazine after vision inspection and inking for defect unit.
Specification
Package Type | Semiconductor devices |
UPH | 80,000 - 100,000 |
Minimum Detected Area | 3mil × 3mil |
Controller | PLC or PC Based |
AVI Capability |
2D Mark Inspection 2D Package Inspection Bottom Pad & Lead Inspection Bottom Package Inspection |
Communication | IO, Serial Port, Ethernet |
Dimension | 1,900 mm(L) x 900mm(D) x 1,650mm(H) |