Wire Bond AOI Vision Inspection Handler

Stationary camera station with high speed and high accuracy vision inspection system which support multiple package and type. Handler is designed with double shutter in order to achieve higher output. Automated conveyor system is used to transport multiple magazines rack horizontally. Gripper system is used to hold and lift magazine racks precisely to pusher station. Pusher is loaded with spring to prevent jam occurs. Laser sensor is installed to detect the presence or absence of frame. Shutter is equipped with built-in jig and index hold sensor to track frame alignment to ensure frame is in position. Shutter moves in X & Y axis for vision inspection. Clamper is used to reduce the warping of the frame.

This handler provides few treatment solutions:
Treatment 1 - Puncher
Treatment 2 - Scratch Mark
Treatment 3 - Cut wire
Treatment 4 - Pull wire


Package Type Semiconductor devices
UPH 5,000 - 8,500
Accuracy +/- 0.5mils
Controller PLC Based
AVI Capability No Bond/ Missing Wire
Bond Width
Long Tail / Off Pad Bonding
Broken Wire
Wedge Mark on Pad
Double Bond
Wrong Bond
Sagging Wire
Shorted Wire
Shifted Wire
Epoxy on Die
Chip Die
Scratches Die
Crack Die
Contamination on Die
Communication IO, Serial Port, Ethernet
Dimension 2180mm(L) x 1000mm(D) x 1640mm(H)