Trim and Form Process

Example of checking criteria

  • Contamination
  • Lead bent
  • Lead broken
  • Lead count
  • Lead missing
  • Lead sweep
  • Lead width

Laser Mark Process

Laser Mark Process

Example of checking criteria

  • Broken
  • Double mark
  • Illegible
  • Mark missing
  • Mixed
  • Tilted
  • Wrong orientation

Molding Process

Molding Process

Example of checking criteria

  • Chip
  • Contamination
  • Crack
  • Package scratch
  • Void

Saw and singulation Process

Saw and Singulation Process

Example of checking criteria

  • Chip
  • Contamination
  • Coplanarity
  • Crack
  • Incomplete saw
  • Lead missing
  • Lead width
  • Scratch
  • Stand off
  • Void

Wafer Mapping Process

Example of checking criteria

  • Chipping
  • Contamination
  • Crack
  • Positioning
  • Void

Die Attach Process

Die Attach Process

Example of checking criteria

  • Chipping
  • Contamination
  • Cracking
  • Die position
  • Missing
  • Orientation
  • Size and dimension
  • Tilted angle

Plating Process

Plating process

Example of checking criteria

  • Bent
  • Broken
  • Color
  • Contamination
  • Incomplete
  • Missing
  • Oxidation
  • Size and dimension

Wire Bond Process

Wire Bond Process

Example of checking criteria

  • Abnormal loop
  • Broken stitch
  • Contamination
  • Dislocation
  • Epoxy on die
  • Excess glue
  • High loop
  • Neck cut
  • Pressure
  • Scribe short
  • Wire bent
  • Wire hanging
  • Wire low loop
  • Wire missing
  • Wire shot tap

Ball Attached Process

Ball Attached Process

Example of checking criteria

  • Ball pitch
  • Bridging
  • Contamination
  • Damage ball
  • Diameter
  • Extra ball
  • Missing
  • Offset
  • Package chip
  • Package orientation
  • Package scratch
  • Package size
  • Unit height