Vision Integration at ACA
We are a leading Advanced Machine Vision Inspection Solution & Technology Provider in the semiconductors industry. By delivering cutting-edge technologies, performance, and offers real-time image processing to accelerate inspection system decisions.
End of Line Semiconductor
Mid-end of line refers to the stages of semiconductor manufacturing that occur after the wafer has been processed, but before the device packaging and final testing. During mid-end inspection, visual inspection is performed on the individual chips that have been cut from the wafer to detect any defects or irregularities in the chip design or fabrication process.
Mark Scan Pack Process
The trim and form process is a critical step in the mid-line of semiconductor manufacturing, following the completion of the wafer processing stage. During this process, individual semiconductor devices are separated from the wafer and undergo a series of physical modifications to prepare them for use in electronic devices.
The trim process involves cutting the individual semiconductor devices from the wafer using a mechanical saw or laser cutter. The cut devices are then inspected for any defects or irregularities, which may be detected using visual inspection techniques such as wire bond AOI or device AOI
Checking Criteria
– Lead
– Orientation
– Marking
– Package
Vision Handler
The laser mark process is a key step in the front-end and mid-line of visual integration in semiconductor manufacturing. This process involves using a laser to mark individual semiconductor devices with unique identifiers or other information, such as logos or serial numbers.
During the laser mark process, a focused laser beam is used to etch or ablate a thin layer of material from the surface of the semiconductor device. This process creates a permanent mark that can be used to identify the device or provide other important information for quality control or traceability purposes.
Checking Criteria
– Lead
– Orientation
– Marking
– Package
Tray to Tray Process
The molding process is an important step in the front-end and mid-line of visual integration in semiconductor manufacturing. This process involves encapsulating individual semiconductor devices in a protective material, typically a thermosetting resin,
to protect them from physical damage, moisture, and other environmental factors.
During the molding process, the individual semiconductor devices are placed in a mold cavity, and the mold is filled with a liquid resin material. The resin material is then cured using heat and pressure to form a solid, protective encapsulation around the device.
Checking Criteria
– Chip
– Illegible Mark
– Mark Missing
– Mark Titled
– Scratch
– Crack
– Mark Broken
– Mark Mixed
– Orientation
– Void
Reel to Reel / Tape to Reel Process
The saw and singulation process is a critical step in the front-end and mid-line of visual integration in semiconductor manufacturing. This process involves separating individual
semiconductor devices from the wafer using a mechanical saw or laser cutter.
During the saw and singulation process, the wafer is mounted onto a thin tape or film and then placed on a dicing saw or laser cutter. The saw or laser is used to cut the wafer into individual die, each containing a single semiconductor device. Once the die are separated from the wafer, they are typically transferred to a tray or carrier for further processing.
Checking Criteria
– Chip
– Marking
– Overturn
– Seal Quality
– Void
– Crack
– Orientation
– Scratch
– Tape Offset
Test Handler
The wafer mapping process is a critical step in the front-end and mid-line of visual integration in semiconductor manufacturing. This process involves mapping the locations of individual semiconductor devices on a wafer, typically using a specialized mapping tool such as a wafer prober.
During the wafer mapping process, the wafer is loaded onto the wafer prober, which uses a series of electrical contacts to test each individual device on the wafer. As each device is tested, its location on the wafer is recorded in a map or database, allowing the semiconductor manufacturer to identify any defects or issues with specific areas of the wafer.
Checking Criteria
– Lead
– Orientation
– Positioning
– Marking
– Package
