Vision Integration at ACA
We are a leading Advanced Machine Vision Inspection Solution & Technology Provider in the semiconductors industry. By delivering cutting-edge technologies, performance, and offers real-time image processing to accelerate inspection system decisions.
Front / Mid of Line Semiconductor
Front-end refers to the initial stages of the semiconductor manufacturing process, which includes the production of the semiconductor wafer. During this stage, visual inspection is performed on the wafer to detect any defects or irregularities in the material.
Mid-end of line refers to the stages of semiconductor manufacturing that occur after the wafer has been processed, but before the device packaging and final testing. During mid-end inspection, visual inspection is performed on the individual chips that have been cut from the wafer to detect any defects or irregularities in the chip design or fabrication process.
Trim & Form Process
The trim and form process is a critical step in the mid-line of semiconductor manufacturing, following the completion of the wafer processing stage. During this process, individual semiconductor devices are separated from the wafer and undergo a series of physical modifications to prepare them for use in electronic devices.
The trim process involves cutting the individual semiconductor devices from the wafer using a mechanical saw or laser cutter. The cut devices are then inspected for any defects or irregularities, which may be detected using visual inspection techniques such as wire bond AOI or device AOI.
Checking Criteria
– Contamination
– Lead Broken
– Lead Missing
– Lead Width
– Lead Bent
– Lead Count
– Lead Sweep
Laser Mark Process
The laser mark process is a key step in the front-end and mid-line of visual integration in semiconductor manufacturing. This process involves using a laser to mark individual
semiconductor devices with unique identifiers or other information, such as logos or serial numbers.
During the laser mark process, a focused laser beam is used to etch or ablate a thin layer of material from the surface of the semiconductor device. This process creates a permanent mark that can be used to identify the device or provide other important information for quality control or traceability purposes.
Checking Criteria
– Broken
– Illegible
– Mixed
– Wrong Orientation
– Double Mark
– Mark Missing
– Tilted
Molding Process
The molding process is an important step in the front-end and mid-line of visual integration in semiconductor manufacturing. This process involves encapsulating individual semiconductor devices in a protective material, typically a thermosetting resin,
to protect them from physical damage, moisture, and other environmental factors.
During the molding process, the individual semiconductor devices are placed in a mold cavity, and the mold is filled with a liquid resin material. The resin material is then cured using heat and pressure to form a solid, protective encapsulation around the device.
Checking Criteria
– Chip
– Crack
– Void
– Contamination
– Package Scratch
Saw and Singulation Process
The saw and singulation process is a critical step in the front-end and mid-line of visual integration in semiconductor manufacturing. This process involves separating individual
semiconductor devices from the wafer using a mechanical saw or laser cutter.
During the saw and singulation process, the wafer is mounted onto a thin tape or film and then placed on a dicing saw or laser cutter. The saw or laser is used to cut the wafer into individual die, each containing a single semiconductor device. Once the die are separated from the wafer, they are typically transferred to a tray or carrier for further processing.
Checking Criteria
– Chip
– Coplanarity
– Incomplete Saw
– Lead Width
– Stand Off
– Contamination
– Crack
– Lead Missing
– Scratch
– Void
Wafer Mapping Process
The wafer mapping process is a critical step in the front-end and mid-line of visual integration in semiconductor manufacturing. This process involves mapping the locations of individual semiconductor devices on a wafer, typically using a specialized mapping tool such as a wafer prober.
During the wafer mapping process, the wafer is loaded onto the wafer prober, which uses a series of electrical contacts to test each individual device on the wafer. As each device is tested, its location on the wafer is recorded in a map or database, allowing the semiconductor manufacturer to identify any defects or issues with specific areas of the wafer.
Checking Criteria
– Chipping
– Crack
– Void
– Contamination
– Positioning
Wire Bond Process
The wire bond process is a critical step in the front-end and mid-line of visual integration in semiconductor manufacturing. This process involves bonding thin wires, typically made of gold or aluminum, to connect the semiconductor device on the
wafer to the external leads or contacts that allow the device to be connected to a circuit board or other electronic components.
During the wire bond process, the wafer is typically mounted onto a bond platform, and the bonding wires are fed through a specialized tool called a wire bonder. The wire bonder uses heat, pressure, and ultrasonic vibrations to bond the wires to the device and the external leads or contacts.
Checking Criteria
– Abnormal Loop
– Contamination
– Epoxy on Die
– High Loop
– Pressure
– Wire Bent
– Wire Low Loop
– Wire Shot Tap
– Broken Stitch
– Dislocation
– Excess Flue
– Neck Cut
– Scribe Short
– Wire Hanging
– Wire Missing
Ball Attached Process
The ball attach process is a critical step in the front-end and mid-line of visual integration in semiconductor manufacturing. This process involves attaching small balls of solder to the pads on a semiconductor device, which allows the device to be connected to external leads or contacts.
During the ball attach process, the semiconductor device is typically mounted onto a substrate, and a specialized tool called a ball bonder is used to bond small balls of solder to the device’s pads. The ball bonder uses heat, pressure, and ultrasonic vibrations to bond the solder balls to the pads.
Checking Criteria
– Ball Pitch
– Contamination
– Diameter
– Missing
– Package Chip
– Package Scratch
– Unit Height
– Bridging
– Damage Ball
– Extra Ball
– Offset
– Package Orientation
– Package Size
Die Attach Process
The die attach process is a critical step in the front-end and mid-line of visual integration in semiconductor manufacturing. This process involves attaching a semiconductor chip or “die” to a substrate, typically made of a material like ceramic or plastic.
During the die attach process, the semiconductor die is typically mounted onto the substrate using an adhesive material, which is usually a specialized epoxy. The die and substrate are then heated to cure the adhesive and create a strong bond between the two materials.
Checking Criteria
– Chipping
– Cracking
– Missing
– Size and Dimension
– Contamination
– Die Position
– Orientation
– Titled Angle
Plating Process
The plating process is a critical step in the front-end and mid-line of visual integration in semiconductor manufacturing. This process involves depositing a thin layer of metal onto a substrate, typically to create a conductive pathway or to protect the underlying material from corrosion.
During the plating process, the substrate is typically placed into a specialized plating solution, which contains metal ions that are attracted to the substrate’s surface. An electrical current is then applied to the plating solution, causing the metal ions to deposit onto the substrate’s surface in a thin layer.
Checking Criteria
– Bent
– Color
– Incomplete
– Oxidation
– Broken
– Contamination
– Missing
– Size and Dimension
